PGA pin grid array package
PGA (Pin Grid Array Package) chip package inside and outside of the chip has multiple party formation of pins, sae hydraulic flanges each pin square formation along the chip are arranged around a certain distance away. According pin as the number, you can circle surrounded by 2-5. When installing the chip into a special PGA sockets. To enable the CPU to more easily install and remove, start from 486 chip, there's called ZIF CPU socket, designed to meet the PGA package installation and removal on the CPU requirements.
ZIF (Zero Insertion Force Socket) is a zero insertion force socket. This socket wrench to gently lift, CPU hydraulic cutting machine can be easily and easily into the socket. Then press the lever back into place, the use of the special structure of socket itself extrusion pressure generated by the CPU firmly pin and socket contacts, there is absolutely no problem of poor contact. Simply remove the CPU chip and socket wrench gently lift, the pressure lifted, CPU chip can be easily removed.
PGA package has the following characteristics:
1 plug operation more convenient, and high reliability.
2 can be adapted to higher frequencies.
Intel series CPU, the 80486 waterwash fitting and Pentium, Pentium Pro are using this package.
2014年5月21日星期三
hydraulic cutting machine hermosetting resin products of repression
the hydraulic machine works Hydraulic works. Large and small area of the piston of S2, S1, to make the hydraulic piston
Force respectively F2, F1. hydraulic cutting machine According to Pascal's principle, the same throughout the sealed fluid pressure, i.e. F2/S2 = F1/S1 = p; F2 = F1 (S2/S1). Represents the gain of the hydraulic effect, the mechanical advantage, as the force increases, but does not gain power, so a large movement of the plunger the plunger movement from a small distance S1 / S 2-fold.
Basic principle is to pump the hydraulic fluid delivered to the integrated cartridge valve block, through the various check valve and pressure relief valve assigned to the hydraulic oil cylinder upper chamber, or lower chamber, the role of oil in the high pressure, so that the cylinder exercise. Hydraulic the use of the pressure fluid to pass hydraulic hose assemblies the device. Liquid transfer in a sealed pressure vessel is to follow Pascal's law. Column hydraulic machine hydraulic system from the power sector, the control mechanism, actuators, auxiliary bodies and working media components. Power mechanism usually used as a power pump body, usually integrated oil pump. In order to meet the requirements of the actuator velocity, use a pump or multiple pumps. Low pressure (Hydraulic less than 2.5MP) with a gear pump; medium pressure (oil pressure is less than 6.3MP) with vane pump; pressure (oil pressure is less than 32.0MP) with a piston pump. Pressure of various plastic hydraulic ferrule materials processing and forming, such as stainless steel plate extrusion, bending, stretching and cold forming metal parts, but can be used for powder products, grinding wheel, bakelite, a thermosetting resin products of repression
Force respectively F2, F1. hydraulic cutting machine According to Pascal's principle, the same throughout the sealed fluid pressure, i.e. F2/S2 = F1/S1 = p; F2 = F1 (S2/S1). Represents the gain of the hydraulic effect, the mechanical advantage, as the force increases, but does not gain power, so a large movement of the plunger the plunger movement from a small distance S1 / S 2-fold.
Basic principle is to pump the hydraulic fluid delivered to the integrated cartridge valve block, through the various check valve and pressure relief valve assigned to the hydraulic oil cylinder upper chamber, or lower chamber, the role of oil in the high pressure, so that the cylinder exercise. Hydraulic the use of the pressure fluid to pass hydraulic hose assemblies the device. Liquid transfer in a sealed pressure vessel is to follow Pascal's law. Column hydraulic machine hydraulic system from the power sector, the control mechanism, actuators, auxiliary bodies and working media components. Power mechanism usually used as a power pump body, usually integrated oil pump. In order to meet the requirements of the actuator velocity, use a pump or multiple pumps. Low pressure (Hydraulic less than 2.5MP) with a gear pump; medium pressure (oil pressure is less than 6.3MP) with vane pump; pressure (oil pressure is less than 32.0MP) with a piston pump. Pressure of various plastic hydraulic ferrule materials processing and forming, such as stainless steel plate extrusion, bending, stretching and cold forming metal parts, but can be used for powder products, grinding wheel, bakelite, a thermosetting resin products of repression
2014年5月15日星期四
hydraulic hose clamps The brake coil when the rated excitation voltage
electro-hydraulic block brake structure and working principleThe brake yoke, the excitation coil springs, disc, armature, spline sleeve, mounting screws, etc., the brake device mounted on the flange (or motors) the rear stretch; sleeve and the spline shaft brake disc coupling.
The brake coil when the rated excitation voltage (DC), the electromagnetic force pull armature, the armature hydraulic hose clamps from the brake disc (released), then the drive shaft with the brake disc or start normal operation, when the separation or broken drive power, the brake is off at the same time, then the pressure in the armature spring force to the armature and the brake disc friction torque between the flanges, the drive shaft speed to stop. The brake thermal environment is poor, the drive shaft is long continuous work, if conditions allow, you can brake work, keep the voltage is converted to 70% -80% of the rated voltage to reduce fever.
4 Qian Dai electromagnetic brake chain tail electromagnetic brake
The moving parts of the mechanical stop or slow down the mechanical parts. Commonly known as brakes, brake. Qian Dai primarily by electromagnetic brake brake frame, brake components and control devices and other components. Some of the electromagnetic brake is also equipped with an automatic brake clearance adjustment device member.
Some electromagnetic brake has been standardized and serialized by a professional factory for selection. Qian Dai hydraulic flange electromagnetic brake is an ideal modern industrial automation actuators, mainly from the transmission system in the mechanical power transmission and control of movement and so on. Compact structure, simple operation, sensitive response, long life, reliable, easy to implement remote control and so on.
It is mainly with the series motor support. Widely used in metallurgy, construction, chemical, food, machine tools, stage, elevators, ships, packaging machinery, and when power (risk prevention) braking and other occasions.
So that the mechanical moving parts to stop or slow down the drag torque must be applied is called the braking torque. Braking torque is the design, selection based on the brake, and its size is determined by the type of machinery and work requirements of the decision. Brake friction material used on the (brake parts) directly affects the performance of the braking process, which will affect the performance of the main factors for the operating temperature and temperature rise speed. Friction material should have a high and stable coefficient of friction and good wear resistance. Metallic and non-metallic friction material sub categories. The former are hydraulic couplers commonly used cast iron, steel, bronze and powder metallurgy friction material, which has leather, rubber, wood and asbestos.
The brake coil when the rated excitation voltage (DC), the electromagnetic force pull armature, the armature hydraulic hose clamps from the brake disc (released), then the drive shaft with the brake disc or start normal operation, when the separation or broken drive power, the brake is off at the same time, then the pressure in the armature spring force to the armature and the brake disc friction torque between the flanges, the drive shaft speed to stop. The brake thermal environment is poor, the drive shaft is long continuous work, if conditions allow, you can brake work, keep the voltage is converted to 70% -80% of the rated voltage to reduce fever.
4 Qian Dai electromagnetic brake chain tail electromagnetic brake
The moving parts of the mechanical stop or slow down the mechanical parts. Commonly known as brakes, brake. Qian Dai primarily by electromagnetic brake brake frame, brake components and control devices and other components. Some of the electromagnetic brake is also equipped with an automatic brake clearance adjustment device member.
Some electromagnetic brake has been standardized and serialized by a professional factory for selection. Qian Dai hydraulic flange electromagnetic brake is an ideal modern industrial automation actuators, mainly from the transmission system in the mechanical power transmission and control of movement and so on. Compact structure, simple operation, sensitive response, long life, reliable, easy to implement remote control and so on.
It is mainly with the series motor support. Widely used in metallurgy, construction, chemical, food, machine tools, stage, elevators, ships, packaging machinery, and when power (risk prevention) braking and other occasions.
So that the mechanical moving parts to stop or slow down the drag torque must be applied is called the braking torque. Braking torque is the design, selection based on the brake, and its size is determined by the type of machinery and work requirements of the decision. Brake friction material used on the (brake parts) directly affects the performance of the braking process, which will affect the performance of the main factors for the operating temperature and temperature rise speed. Friction material should have a high and stable coefficient of friction and good wear resistance. Metallic and non-metallic friction material sub categories. The former are hydraulic couplers commonly used cast iron, steel, bronze and powder metallurgy friction material, which has leather, rubber, wood and asbestos.
2014年5月13日星期二
hydraulic cutting machine multiple party formation of pins
PGA pin grid array package
PGA (Pin Grid Array Package) chip package inside and outside of the chip has multiple party formation of pins, hydraulic cutting machine each pin square formation along the chip are arranged around a certain distance away. According pin as the number, you can circle surrounded by 2-5. When installing the chip into a special PGA sockets. To enable the CPU to more easily install and remove, start from 486 chip, there's called ZIF CPU socket, designed to meet the PGA package installation and removal on the CPU requirements.
ZIF (Zero Insertion Force Socket) is a zero insertion force socket. This socket wrench to gently lift, CPU can be easily and easily into the socket. Then press the lever back into place, the use of the special structure of socket itself extrusion pressure generated by hydraulic cartridge valves the CPU firmly pin and socket contacts, there is absolutely no problem of poor contact. Simply remove the CPU chip and socket wrench gently lift, the pressure lifted, CPU chip can be easily removed.
PGA package has the following characteristics:
1 plug operation more convenient, and high reliability.
2 can be adapted to higher frequencies.
Intel series CPU, the 80486 and Pentium, Pentium Pro are using this package.
PGA (Pin Grid Array Package) chip package inside and outside of the chip has multiple party formation of pins, hydraulic cutting machine each pin square formation along the chip are arranged around a certain distance away. According pin as the number, you can circle surrounded by 2-5. When installing the chip into a special PGA sockets. To enable the CPU to more easily install and remove, start from 486 chip, there's called ZIF CPU socket, designed to meet the PGA package installation and removal on the CPU requirements.
ZIF (Zero Insertion Force Socket) is a zero insertion force socket. This socket wrench to gently lift, CPU can be easily and easily into the socket. Then press the lever back into place, the use of the special structure of socket itself extrusion pressure generated by hydraulic cartridge valves the CPU firmly pin and socket contacts, there is absolutely no problem of poor contact. Simply remove the CPU chip and socket wrench gently lift, the pressure lifted, CPU chip can be easily removed.
PGA package has the following characteristics:
1 plug operation more convenient, and high reliability.
2 can be adapted to higher frequencies.
Intel series CPU, the 80486 and Pentium, Pentium Pro are using this package.
hydraulic manifold block With the development of integrated circuit
BGA ball grid array package
With the development of integrated circuit technology, integrated circuit packaging requirements more stringent. This is because the packaging technology related to the functionality hydraulic ferrule fittings of the product, when the IC when the frequency exceeds 100MHz, traditional packaging methods may produce so-called "CrossTalk" phenomenon, and when the IC pin count is greater than 208 Pin, conventional packaging methods are its difficulty. Therefore, in addition to using the QFP package, but most of today's high-pin-count chips (such as graphics chips and chipsets, etc.) are used instead BGA (Ball Grid Array Package) packaging technology. BGA appeared became CPU, motherboard Northbridge / Southbridge chip high-density, high-performance, multi-pin package the best choice.
Details BGA packaging technology can be divided into five categories:
1.PBGA (Plasric BGA) substrates: generally 2-4 layers of multilayer organic material. Series CPU in Intel, Pentium II, III, IV processors are using this package.
2.CBGA (CeramicBGA) substrate: a ceramic substrate, the chip and the substrate usually electrical connection between the flip-chip (FlipChip, abbreviated FC) is installed. Series CPU in Intel,hydraulic manifold block Pentium I, II, Pentium Pro processors are adopted such a package.
3.FCBGA (FilpChipBGA) substrate: Rigid multilayer substrate.
4.TBGA (TapeBGA) substrate: a substrate for the ribbon soft 1-2 layer PCB.
5.CDPBGA (Carity Down PBGA) substrate: refers to the central square sunken packaged chip area (also known as the cavity area).
BGA package has the following characteristics:
1.I / O pin count although increased, but much larger than the distance between pin QFP package to improve the yield.
(2) Although the power consumption increases the BGA, but due to the controlled collapse chip welding, which can improve the heating performance.
3 signal transmission delay is small, adaptive frequency greatly improved.
4 coplanar welding assembly availability, reliability is greatly improved.
BGA package after ten years of development has entered a practical stage. In 1987, Japanese Citizen (Citizen) Company began to develop plastic ball grid array package surface of the chip (ie, BGA). hydraulic hose assemblies Then, Motorola, Compaq and other companies also went into the development of the BGA ranks. In 1993, Motorola will be the first BGA used in mobile phones. In the same year, Compaq also workstations, PC computer to be applied. Until 56 years ago,, Intel Corporation in the computer the CPU (ie, Pentium II, Pentium III, Pentium IV, etc.), as well as chipsets (eg i850) started using BGA, BGA applications extend this right to play a role in fueling. Currently, BGA has become extremely popular IC packaging technology, its global market size in 2000 was 1.2 billion, the market demand is expected in 2005 than in 2000 more than 70% rate of growth.
With the development of integrated circuit technology, integrated circuit packaging requirements more stringent. This is because the packaging technology related to the functionality hydraulic ferrule fittings of the product, when the IC when the frequency exceeds 100MHz, traditional packaging methods may produce so-called "CrossTalk" phenomenon, and when the IC pin count is greater than 208 Pin, conventional packaging methods are its difficulty. Therefore, in addition to using the QFP package, but most of today's high-pin-count chips (such as graphics chips and chipsets, etc.) are used instead BGA (Ball Grid Array Package) packaging technology. BGA appeared became CPU, motherboard Northbridge / Southbridge chip high-density, high-performance, multi-pin package the best choice.
Details BGA packaging technology can be divided into five categories:
1.PBGA (Plasric BGA) substrates: generally 2-4 layers of multilayer organic material. Series CPU in Intel, Pentium II, III, IV processors are using this package.
2.CBGA (CeramicBGA) substrate: a ceramic substrate, the chip and the substrate usually electrical connection between the flip-chip (FlipChip, abbreviated FC) is installed. Series CPU in Intel,hydraulic manifold block Pentium I, II, Pentium Pro processors are adopted such a package.
3.FCBGA (FilpChipBGA) substrate: Rigid multilayer substrate.
4.TBGA (TapeBGA) substrate: a substrate for the ribbon soft 1-2 layer PCB.
5.CDPBGA (Carity Down PBGA) substrate: refers to the central square sunken packaged chip area (also known as the cavity area).
BGA package has the following characteristics:
1.I / O pin count although increased, but much larger than the distance between pin QFP package to improve the yield.
(2) Although the power consumption increases the BGA, but due to the controlled collapse chip welding, which can improve the heating performance.
3 signal transmission delay is small, adaptive frequency greatly improved.
4 coplanar welding assembly availability, reliability is greatly improved.
BGA package after ten years of development has entered a practical stage. In 1987, Japanese Citizen (Citizen) Company began to develop plastic ball grid array package surface of the chip (ie, BGA). hydraulic hose assemblies Then, Motorola, Compaq and other companies also went into the development of the BGA ranks. In 1993, Motorola will be the first BGA used in mobile phones. In the same year, Compaq also workstations, PC computer to be applied. Until 56 years ago,, Intel Corporation in the computer the CPU (ie, Pentium II, Pentium III, Pentium IV, etc.), as well as chipsets (eg i850) started using BGA, BGA applications extend this right to play a role in fueling. Currently, BGA has become extremely popular IC packaging technology, its global market size in 2000 was 1.2 billion, the market demand is expected in 2005 than in 2000 more than 70% rate of growth.
hydraulic valve manifold With the global electronics personalization
CSP Chip Scale Package
With the global electronics personalization, light of the needs of a growing trend, packaging technology hydraulic valve manifold has advanced to CSP (Chip Size Package). It reduces the size of the chip package outline, so bare chip sizes, the package size is as big. Dimensions of the packaged IC chip side grow up to 1.2 times, IC area than just die (Die) no larger than 1.4 times.
CSP package can be divided into four categories:
1.Lead Frame Type (traditional leadframe form), on behalf of manufacturers are Fujitsu, Hitachi, Rohm, Goldstar (Goldstar) and so on.
2.Rigid Interposer Type (rigid interposer type), on behalf of manufacturers are Motorola, Sony, Toshiba, Panasonic and more.
3.Flexible Interposer Type (soft inner flapper type), one of the most famous is Tessera's microBGA, CTS's sim-BGA also uses the same principle. Other representatives of manufacturers including General Electric (GE) and NEC.
4.Wafer Level Package (wafer scale package): Unlike traditional single chip package, WLCSP entire wafer is cut into dolphin single chip, which claims to be the future of mainstream hydraulic hose assemblies packaging technology, has been put into research and development vendors, including FCT, Aptos, Casio, EPIC, Fujitsu, Mitsubishi Electronics.
CSP package has the following characteristics:
1 meets the chip I / O pins increasing needs.
2 chip area and the ratio between the small package size.
3. Greatly shorten the delay time.
CSP package for small pin count IC, such as memory and portable electronic products. The future will be widely used in information appliances (IA), digital television (DTV), books (E-Book), Wi-Fi WLAN / GigabitEthemet, ADSL / phone chip, Bluetooth (Bluetooth) hydraulic ferrule fittings and other new products.
With the global electronics personalization, light of the needs of a growing trend, packaging technology hydraulic valve manifold has advanced to CSP (Chip Size Package). It reduces the size of the chip package outline, so bare chip sizes, the package size is as big. Dimensions of the packaged IC chip side grow up to 1.2 times, IC area than just die (Die) no larger than 1.4 times.
CSP package can be divided into four categories:
1.Lead Frame Type (traditional leadframe form), on behalf of manufacturers are Fujitsu, Hitachi, Rohm, Goldstar (Goldstar) and so on.
2.Rigid Interposer Type (rigid interposer type), on behalf of manufacturers are Motorola, Sony, Toshiba, Panasonic and more.
3.Flexible Interposer Type (soft inner flapper type), one of the most famous is Tessera's microBGA, CTS's sim-BGA also uses the same principle. Other representatives of manufacturers including General Electric (GE) and NEC.
4.Wafer Level Package (wafer scale package): Unlike traditional single chip package, WLCSP entire wafer is cut into dolphin single chip, which claims to be the future of mainstream hydraulic hose assemblies packaging technology, has been put into research and development vendors, including FCT, Aptos, Casio, EPIC, Fujitsu, Mitsubishi Electronics.
CSP package has the following characteristics:
1 meets the chip I / O pins increasing needs.
2 chip area and the ratio between the small package size.
3. Greatly shorten the delay time.
CSP package for small pin count IC, such as memory and portable electronic products. The future will be widely used in information appliances (IA), digital television (DTV), books (E-Book), Wi-Fi WLAN / GigabitEthemet, ADSL / phone chip, Bluetooth (Bluetooth) hydraulic ferrule fittings and other new products.
2014年5月8日星期四
hydraulic cutting machine will by supporting the contractile
steps , Talking hose crimping machine
Hose crimping machine is a tube assemblies for hydraulic crimping device , it will by supporting the contractile force exerted by the metal connector crimping machine mold , the metal hydraulic cutting machine connector firmly withhold the pressure tubing or a car by supporting construction machinery the brake pipe , oil pipe, air conditioning tubes , power tubes . Crimping machine for all kinds of high and low mechanical tubing, pipe , plumbing , cable connectors, automotive air conditioning pipes, power steering pipe , oil pipe , gasoline for tubing, and construction accessories , household hot water pipe withhold widely used vehicles, engineering machinery , hydraulic machinery , welding equipment and other industries.
Procedure
1 sample with a ruler to measure the length of the hose .
2 metal joints using a caliper measurement data , observed sample hose inside diameter .
3 Prepare required hoses and fittings.
4 with a cutting machine to cut the required length of the hose , a hose to clean the hole .
5 skiving machine with outer hydraulic blocks rubber hose stripped , and then insert a metal hose connector sleeve. Note: You must peel off the outer layer of rubber hose .
6 straight pin plug connector metal hose directly to the bottom.
7 . Measuring hose and hose samples are the same length .
8 shrink tube with no taper machined hose.
9 According to the data transfer hose to withhold required by prospective locators .
10. Began to withhold hose, you can use the manual button or using the foot withhold withhold button.
11 hose crimping in place , you can locate the alarm sounds , and then press the button to open the mold .
12. Withhold withhold data caliper measurement is completed , with the probe detection.
13 hose to the required data hydraulic cartridge valves can be withheld .
14 Withhold completed, shut off the power.
Hose crimping machine is a tube assemblies for hydraulic crimping device , it will by supporting the contractile force exerted by the metal connector crimping machine mold , the metal hydraulic cutting machine connector firmly withhold the pressure tubing or a car by supporting construction machinery the brake pipe , oil pipe, air conditioning tubes , power tubes . Crimping machine for all kinds of high and low mechanical tubing, pipe , plumbing , cable connectors, automotive air conditioning pipes, power steering pipe , oil pipe , gasoline for tubing, and construction accessories , household hot water pipe withhold widely used vehicles, engineering machinery , hydraulic machinery , welding equipment and other industries.
Procedure
1 sample with a ruler to measure the length of the hose .
2 metal joints using a caliper measurement data , observed sample hose inside diameter .
3 Prepare required hoses and fittings.
4 with a cutting machine to cut the required length of the hose , a hose to clean the hole .
5 skiving machine with outer hydraulic blocks rubber hose stripped , and then insert a metal hose connector sleeve. Note: You must peel off the outer layer of rubber hose .
6 straight pin plug connector metal hose directly to the bottom.
7 . Measuring hose and hose samples are the same length .
8 shrink tube with no taper machined hose.
9 According to the data transfer hose to withhold required by prospective locators .
10. Began to withhold hose, you can use the manual button or using the foot withhold withhold button.
11 hose crimping in place , you can locate the alarm sounds , and then press the button to open the mold .
12. Withhold withhold data caliper measurement is completed , with the probe detection.
13 hose to the required data hydraulic cartridge valves can be withheld .
14 Withhold completed, shut off the power.
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