hydraulic valve manifold With the global electronics personalization

CSP Chip Scale Package
With the global electronics personalization, light of the needs of a growing trend, packaging technology hydraulic valve manifold has advanced to CSP (Chip Size Package). It reduces the size of the chip package outline, so bare chip sizes, the package size is as big. Dimensions of the packaged IC chip side grow up to 1.2 times, IC area than just die (Die) no larger than 1.4 times.
CSP package can be divided into four categories:
1.Lead Frame Type (traditional leadframe form), on behalf of manufacturers are Fujitsu, Hitachi, Rohm, Goldstar (Goldstar) and so on.
2.Rigid Interposer Type (rigid interposer type), on behalf of manufacturers are Motorola, Sony, Toshiba, Panasonic and more.
3.Flexible Interposer Type (soft inner flapper type), one of the most famous is Tessera's microBGA, CTS's sim-BGA also uses the same principle. Other representatives of manufacturers including General Electric (GE) and NEC.
4.Wafer Level Package (wafer scale package): Unlike traditional single chip package, WLCSP entire wafer is cut into dolphin single chip, which claims to be the future of mainstream hydraulic hose assemblies packaging technology, has been put into research and development vendors, including FCT, Aptos, Casio, EPIC, Fujitsu, Mitsubishi Electronics.
CSP package has the following characteristics:
1 meets the chip I / O pins increasing needs.
2 chip area and the ratio between the small package size.
3. Greatly shorten the delay time.
CSP package for small pin count IC, such as memory and portable electronic products. The future will be widely used in information appliances (IA), digital television (DTV), books (E-Book), Wi-Fi WLAN / GigabitEthemet, ADSL / phone chip, Bluetooth (Bluetooth) hydraulic ferrule fittings and other new products.