hydraulic manifold block With the development of integrated circuit

BGA ball grid array package
With the development of integrated circuit technology, integrated circuit packaging requirements more stringent. This is because the packaging technology related to the functionality hydraulic ferrule fittings of the product, when the IC when the frequency exceeds 100MHz, traditional packaging methods may produce so-called "CrossTalk" phenomenon, and when the IC pin count is greater than 208 Pin, conventional packaging methods are its difficulty. Therefore, in addition to using the QFP package, but most of today's high-pin-count chips (such as graphics chips and chipsets, etc.) are used instead BGA (Ball Grid Array Package) packaging technology. BGA appeared became CPU, motherboard Northbridge / Southbridge chip high-density, high-performance, multi-pin package the best choice.
Details BGA packaging technology can be divided into five categories:
1.PBGA (Plasric BGA) substrates: generally 2-4 layers of multilayer organic material. Series CPU in Intel, Pentium II, III, IV processors are using this package.
2.CBGA (CeramicBGA) substrate: a ceramic substrate, the chip and the substrate usually electrical connection between the flip-chip (FlipChip, abbreviated FC) is installed. Series CPU in Intel,hydraulic manifold block  Pentium I, II, Pentium Pro processors are adopted such a package.
3.FCBGA (FilpChipBGA) substrate: Rigid multilayer substrate.
4.TBGA (TapeBGA) substrate: a substrate for the ribbon soft 1-2 layer PCB.
5.CDPBGA (Carity Down PBGA) substrate: refers to the central square sunken packaged chip area (also known as the cavity area).
BGA package has the following characteristics:
1.I / O pin count although increased, but much larger than the distance between pin QFP package to improve the yield.
(2) Although the power consumption increases the BGA, but due to the controlled collapse chip welding, which can improve the heating performance.
3 signal transmission delay is small, adaptive frequency greatly improved.
4 coplanar welding assembly availability, reliability is greatly improved.
BGA package after ten years of development has entered a practical stage. In 1987, Japanese Citizen (Citizen) Company began to develop plastic ball grid array package surface of the chip (ie, BGA). hydraulic hose assemblies Then, Motorola, Compaq and other companies also went into the development of the BGA ranks. In 1993, Motorola will be the first BGA used in mobile phones. In the same year, Compaq also workstations, PC computer to be applied. Until 56 years ago,, Intel Corporation in the computer the CPU (ie, Pentium II, Pentium III, Pentium IV, etc.), as well as chipsets (eg i850) started using BGA, BGA applications extend this right to play a role in fueling. Currently, BGA has become extremely popular IC packaging technology, its global market size in 2000 was 1.2 billion, the market demand is expected in 2005 than in 2000 more than 70% rate of growth.